電子器件燒結用石墨治具應用領域
電子器件燒結用石墨治具應用范疇：
電子器件燒結用石墨治具廣泛應用于半導體封裝、集成電路(IC)制作、電子元器件封裝等范疇。
特別是在半導體封裝工藝中，電子器件燒結用石墨治具用于承載和固定半導體芯片，確保芯片在高溫文特定氣氛下的燒結過程中能夠穩(wěn)定地與其他部件結合。
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